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Additional info for Advances in Joining of Ceramics: Proceedings of the symposium held at the 104th Annual Meeting of The American Ceramic Society, April 28-May1, 2002 in ... Transactions (Ceramic Transactions Series)
Westerville, OH, 1998. 79. J. G. Lee and E. D. Case, "Microwave Joining of Particulate Composites"), pp. , Westerville, OH, 2000. 80. S. P. Kovdev, P. Miranzo and M. I. Osendi, "Finite element simulation of thermal residual stresses in joining ceramics with thin metal interlayers", J. Am. Ceram. , 81: 2342-2348,1998. 81. T. F. , Y. H. Chang, D. L. Yu, F. S. Yen, D. S. Tsai, and I. N. Sci. and Engineering, A147 121-128,1991. 82. T. F. Yen, Y. H. Chang, D. S. Tsai, S. L. Duh and S. J. Yang, "LiF-film-assisted diffusion bonding of MgF2 ceramics," Mat.
9 , 544-549(1991). Takahashi, M. Inoue, “Numerical Study of Wire Bonding---Analysis of Interfacial Deformation Between Wire and Pad,” ASME J. Electronic Packaging, 124, 27-36 (2002). Advances in Joining of Ceramics 47 This page intentionally left blank DESIGNING JOINTS WITH GRADED LAYERS J. Stamile, I. E. Reimanis Metallurgical and Materials Engineering Department Colorado School of Mines Golden, Coforado 80401 USA J. Chapa-Cabrera Caterpillar Inc. O. Box 1875 Peoria, Illinois 61 656-1875 ABSTRACT Finite element modeling has been used to examine cracking behavior in elastic, discretely layered, graded joints.
D. Case, "Joining zirconia, alumina and HAP bioceramics", in this proceedings. 28 Advances in Joining of Ceramics NUMERICAL MODELING OF SOLID STATE BONDING BASED ON FUNDAMENTALBONDING MECHANISMS ----FORBONDING BETWEEN DISSIMILAR MATERIALS---Yasuo TAKAHASHI JWRI,Osaka University 11-1, Mihogaoka, Ibaraki, Osaka, 567-0047, Japan ABSTRACT Numerical modeling methods that can be used as tools for developing and processing bonds between dissimilar materials are discussed. The solid state bonding process controlled by the intimate contact stage is rnodeled, based on the fundamental mechanisms such as plastic deformation, visco-plastic (creep) deformation, interface diffusion, and volume diffusion.